Cooled DSLR History 4

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heatpipe and attachable cooling unit……………………………06. 03. 20

I designed to change the heatpipe cooler to get removable.

The most hampered thing on the models before was the disorganized  heatsink and fan, the outer coolers of the camera. To make this neat I thought that there is a problem putting the peltier device inside the camera. If I put out the TEC out of the camera I was worried that because of the heat course got longer the cooling effectiveness will fall, but after testing I found out that I can still reduce up to 25℃(45 ˚F ).

As cold finger got longer the optic axis sort came up as a new problem. First I crossed the airtight chamber and the optic axis at the 3 support points at the mirror box then I fixed the airtight chamber to housing with pins to sort the CMOS. airtight chamber is to thermal conduction at the high temperature area so that the peltier’s end will also be close to the normal temperature. And this will prevent the dew condensation at surfaces of the airtight chamber. But there are disadvantages caused by connection with the coldfinger, this causes heat conduction and lowers the frigidus effectiveness and lowers temperatures in the chamber. But I desided to go on. 

In this design only cold finger and airtight chamber makes up a body with a camera. And peltier and heatpipe cooler and the connector that works as a bridge to deliver heat is working as a removal external cooling unit. I used the CPU cooler distributed in the market place.(refer to left picture)

Prices are USD $9.0 and efficiencyis pretty good and most of all it’s shape is very neat. I made few holes at the bottom of the heatpipe to assemble with connector and I cut offed the wings at the bottom and made a neat cube.

I lapped the surfaces of cold finger which combines with the peltier. And I silicon calked the boundary between the airtight chamber base so there won’t be any air coming through.

First, CMOS’s temperature was below 20℃( 36˚F) compared to the normal temperature. Throughout the whole exposure and even when resting the CMOS temperature was stabily+0.5℃(+0.9˚F) ～-0.5℃(-0.9˚F).

left problems to fix :

1. there was no dew condensation at UV/IR filter and chamber housing but when temperature was 26℃(78.8˚F) the very end of the chamber surface was 17℃(62.6˚F) the lowest temperatures in chamber cover plate was 12℃(53.6˚F), CMOS was 5℃(41˚F). I have to change the way from fixingthe cold finger and the housing by a pin. I have to find out other way to isolate heat from cold finger and the airtight chamber housing.

2. there is little space where peltier is placed at, and since we can’t cut off air 100% there is dew condensation at the low temperature area.

3. Since the weight of the heatpipe cooler ain’t light there is some moment effecting so there is some problems about unbalance of the weight.

4. cooler is removable so I can use the camera in compact shape normally but it is not easy to assemble cooler so this have to get handled.

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