Astro350D Modifying Process 2

Astro 350D Modifying Process( 2 )   Process-1 ☞    Process-3 ☞

7.making mainboard’s USB extenasion cable

Remove miniUSB connector from mainboard using soldering iron. Then attach extenansion cable at 2cm length firmly so it won’t fall.

8.removing supporting frame and low pass filter from CMOS sensor

If you look at CMOS sensor from front there is stainless sheild plate around circumference. Loosen and remove two screws, and separate  low pass filter carefully using blade of knife. It is fixed with both-side tape in CMOS.

If you remove copper clips which sticks CMOS with supporting frame by loosening screws you’ll find FPCB cables connected to CMOS just like the picture. 

9.Fixing CMOS sensor to cold finger

First lap commissure of CMOS and peltier from cold finger using abrasive so it smoothes like a mirror. At commissure of CMOS, apply newest Thermal Compound from [Zalman]compamy and put it in the airtight chamber Base Housing. Then place CMOSsensor nicely and use screws to fix it tightly.

10.fixing temperature sensor, bonding lids behind the airtight chamber

Fix digital thermometer’s external temperature sensor at rearside of sensor and commissure of cold finger using epoxy bond. leave plenty margin of line.

Paint Thermal Compound thinly at the side which meets airtight chamber’s rear lid. Close the lid and fix it tightly using six M1.7 screws. The gap which FPCB cables stick out used to be dine by silicon calking, but now we use 3M’s Thermal Tape, which is very thin but still have adhesive strength and no has elasticity at all and has great flexibility and insulibility, to isolate air distribution.


UV/IR Blocking Filter at front side of CMOS is also fixed firmly to airtight chamber with 3M’s Thermal Tape to avoid dust to get in.

11.assembling peltier, airtight chamber outer cover

First solder USB, Remote Controller connecting cable, temperature sensor cable to fifteen pin DSUB connector, the fix it in cover housing it screws. Next put in the copper block which is lapped nicely with the abrasive and the both side of that is combined with airtight chamber’s outercover in to the cover housing. Then at the inner side paint  Thermal Compound equally than stick hot side of the peltier module, and solder peltier’s electric power source to DSUB connector

paint Thermal Compound at commissure of the cold finger which is inside the airtight chamber base housing, and assemble the cover carefully to airtight chamber base housing, then use four M3 screws to fix it.

Process-1 ☞                                                                Process-3 ☞

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