Cooled DSLR History 3

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A study of cooling system using HeatPipe………………………………. 05. 10. 30.

 

Upper picture is a thin heatpipe cooler used regularly in notebook computers. I used this minicooler concept on cooling CMOS sensors.

I asked the developer of CPU cooler company and he says that if I use this round shaped section heatpipe flat, I can’t avoid the efficiency getting lowered. And it has to be over 3mm to be realistic.

 

 

So I was thinking of an alternative plan, and I found this 1.6mm thick aluminum ultra-foiled heatpipe producing company as seen on the right picture. I asked them for buying the samples of it, and they were kind enough to give to me for free. So I could test it.

By putting the heatpipe vertically it’s effective enough but compared to the round shaped heatpipe it’s efficiency differ to much on the change of the phase. Since It’s phase changes time to time when taking pictures of a star, I concluded that it is not right for this usage and gave up this heatpipe.

In the end I went on as designing with flattend round shaped section heatpipe.

had concept of desing by Removing the CMOS’s fixation screws on 300D camera and then I could earn 8mm of space between from camera’s supporting frame and mainboard’s chip protection stainless sheild. And at this space organized airtight chamber and used peltier and heatpipe to frigidus.

There were few problems not solved with this concept. First, CMOS sensor was pushed out so that camera’s AF focus dosen;t match the other focus.

Second, I have to custom design heatpipe and heatsink, and it’s expense won’t be little. and the looks and convenience won’t be that good after the remodeling. etc

 

By considering the focus problems an alternative plan that I came up with was to move the peltier device left and use cold plate to steal CMOS’s heat. And still make heatpipe in round shape to make effectivenss high.

With this idea CMOS can move more backwards so we can equal the camera’s AF system and the focus. And since peltier and the CMOS has enough distance it is hoped that CMOS surface’s dew condensation won’t happen. airtight chamber can get more bigger and as a preperation for dew condensation i’m thinking of putting in a desiccant.

 

 

 

 

And this is the 3D model with this concept.

 

 

 

 

 

 

 

 

 

 

 

 

With the CPU’s heatpipe cooler shown at right, I tested the cooling effectiveness as the change of the phase And it was much lower than I worried about.

 

 

 

 

 

 

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