3D Renderings of Cooled 5D Mark II

    

Using 3D modeling, checked the interference of parts, find the proper assembly procedure and have made a rigid housing that covering ex-cooling unit.

For more user convenience we moved the excooler position, air flow direction,connector. New skiving fin type AL heat sink is right and good for high cooling performance and it have made possible to cool down the temperature of CMOS to ambient temperature – 28℃(+2~-2℃).